【Key words】 superplasticity； lattice structure； boundary gliding； dislocation gliding； intermetallic compounds； traditional dynamic recrystallization； continuous dynamic recrystallization；
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dislocation gliding theory 位错滑移理论
The creep deformation mechanism of Sn-Ag-Bi lead-free solder is dominated by dislocation gliding and climbing mainly, but dislocation gliding holds a leading post.
Sn-Ag-Bi无铅焊料的压入蠕变变形机制主要是由位错滑移和位错攀移共同控制，而且位错滑移占主导地位。
参考来源 - Sn·2,447,543篇论文数据，部分数据来源于NoteExpress
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