superplastic forming and diffusion bond 超塑性成形及扩散结合
the tendency to diffusion bond 扩散焊接势
The interfacial diffusion of alloying element is an important factor to microstructure, apparent hardness and interfacial bond strength.
元素在界面两侧的扩散是影响材料显微组织、表观硬度及界面结合强度的关键。
The hydrogen bond structure and diffusion behavior of water at supercritical states were investigated by MD simulation.
采用分子动力学(MD)模拟的方法对超临界条件下水的结构及扩散性质进行了研究。
However, cracks initialized in the diffusion layer between substrate and bond coat when TBCs were tested with low cycle fatigue at high temperature.
而在高温低周疲劳条件下裂纹是在粘结层与高温合金基体的扩散层处。
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