Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
The interfacial diffusion of alloying element is important to microstructure, microhardness and interfacial bonding strength.
合金元素在界面两侧的扩散是影响材料显微组织、显微硬度及界面结合强度的关键。
The interfacial diffusion of alloying element is an important factor to microstructure, apparent hardness and interfacial bond strength.
元素在界面两侧的扩散是影响材料显微组织、表观硬度及界面结合强度的关键。
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