The synthesis, structure, properties and process interaction of low k dielectrics are reviewed. Characterization techniques for low k dielectric films are summarized.
综述了低介电常数介质薄膜的制备方法、结构与性能表征、工艺兼容性等领域的最新进展。
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.
对于在用作集成电路的层间介电体时的改善性能，确定了低介材 料和包含该材料的薄膜及其制备方法。
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