The first plate electrode is formed on a second inner connection structure provided under the dielectric etch stop layer.
该第一平板电极形成于设于该介电蚀刻停止层下的一第二内连接结构之上。
A first interlayer conductive joint hole is formed on and through an interlayer dielectric layer and a dielectric etch stop layer.
一第一层间导电接孔形成于且穿过一层间介电层以及一介电蚀刻停止层。
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