Tight spinneret again after die heating oven reached technics temp. 3 hours .
箱体加热油炉油温达到工艺温度3小时之后，开始二次紧固喷丝板（热紧）。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
Mainly control on viscosity, the depth of the roller and oven temperature, dry finish, souvenirs…, direct gilding , die-cutting.
主要是控制好上光油的粘度，网纹辊的深度和烘箱的温度即可，上光油瞬间干燥，可直接烫金、模切。
应用推荐