In addition, the first integrated circuit die, the at least one additional die integrated circuits, and the array of acoustic elements together form a large aperture transducer array.

此外，该第一集成电路管芯、该至少一个附加的集成电路管芯以及该声学元件阵列一起形成大孔径换能器阵列。

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Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。

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Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；

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