...片级集成技术进步的一些趋向，在一个小组的讨论中，对晶圆在3-D封装制作前晶圆到晶圆(wafer-to-wafer)和芯片到晶圆(die-to-wafer)互相连接做了简要的概述[2]。
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Wafer Die Disposition: Various functions related to wafer manufacturing and test.
Wafer Die Disposition：各种与晶片制造及测试相关的功能。
You're certainly not a die-hard fundamentalist, but you figure that if you drink the wine and chew the wafer now and then, it's good enough to get you a free ride into a half-decent afterlife.
你绝不是死硬的原教旨主义者，但你认为时而呷一口葡萄酒，慢慢咀嚼着圣饼，徜徉其间感觉还不错，可以顺利地混到下半生。
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