The influence of depth of grinding, feed rate and circular linear speed of the grinding wheel on the grinding forces with respect to the maximum chip thickness of a single active diamond was analyzed.
从单颗金刚石最大切削厚度的角度，分析了磨削深度、进给速度和砂轮线速度对磨削力的影响。
A study on the trends of silver white chip formation when cutting the silicon-aluminium alloy parts with a polymerized crystal diamond cutter is carried out.
对于采用聚晶金刚石刀具加工硅铝合金时产生积屑瘤的一些规律进行了研究。
The surface topography of the diamond grinding wheel and the undeformed chip thickness were measured by using a 3D surface profiler based on scanning white light interferometry.
提出了基于扫描白光干涉原理或移相干涉原理的三维表面轮廓仪对硅片延性域磨削是否实现进行评定的光学轮廓仪法。
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