They never quite implied that all of Intel's next-gen desktopprocessors would be soldered to the motherboard, even if Broadwell (or some of its variants) did happen to go that way.
They claim that desktopprocessors built on Intel's future, 14-nanometer Broadwell architecture will be switching from contacts based on a land grid array (LGA) to a ball grid array (BGA) that could dictate soldering the chips in laptop-style, rather than putting them in an upgrade-friendly socket.