The CPU contains thousands of transistors and logic circuits packaged in a very small design known as an integrated circuit (IC).
CPU包含成千上万个晶体管和逻辑电路,它们被封装在一个很小的设计空间模式,称为集成电路(IC)。
The principle and structure design of temperature compensation package for FBGs are expatiated, temperature characteristic of packaged FBGs is measured.
阐述了温度补偿封装技术的基本原理和结构设计方法,并对封装后的光栅作了温度性能测试。
The cushioning design sensitivity for nonlinear multi degrees of freedom packaged structures is at first analyzed in this paper.
首次对非线性多自由度包装结构缓冲设计进行了灵敏度分析。
应用推荐