... vapor deposition 汽相淀,蒸镀... chemical deposition 化学沉积,化学淀积... deposition process 淀积工艺过程...
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vapor deposition process 气相沉积工艺
vapour deposition process 气相沉积法
electrolytic deposition process 电解过程
pyrolytic deposition process 热解沉积法
pyrolysis deposition process 热解法
outside vapor deposition process sintering 外汽相蒸镀退火
cataphoretic deposition process 阳离子电泳沉积法
The intuitionistic simulation results of deposition process in cathodic arc ion plating by computer are summarized in the paper.
本论文概述了利用计算机来直观模拟多弧离子镀的镀膜过程。
参考来源 - 多弧离子镀沉积过程的计算机模拟研究The major results are as follows:(1) Bulk quantities of hexagonal boron nitride (h-BN) nanosheets have been synthesized via a simple template and catalyst-free chemical vapor deposition process at 1100-1300℃.
以氧化硼和三聚氰胺为前驱体,在1100-1300℃氮气保护下,采用化学气相沉积法在无模板、无催化剂的情况下合成宏量、高纯的氮化硼纳米片。
参考来源 - 六方氮化硼材料的制备及性能研究In this thesis,the problem and mechanism of Cu diffusion at Al boudpad area are studied. And based on this,the TaN deposition process is optimized by a series of comparison experiment.
本文,通过对铜扩散发生机制的一些研究分析,针对铝焊接点的扩散阻挡层工艺进行对比实验,优化其制备工艺。
参考来源 - 铜互连技术中铝焊接点的氮化钽扩散阻挡工艺优化And process conditions were obtained through experiment. Results indicated that reliability of the double-layer metallization was improved by optimizing deposition process to eliminate photoresist and/or corrosive residuals on the chip.
通过实验对比分析,确定芯片的隔离介质淀积工艺条件,从而避免光刻胶、腐蚀液等物质残留在芯片内部,提高双层金属布线的可靠性。
参考来源 - 双层金属布线中隔离介质淀积工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
These conclusions are essential for designing and improving the deposition process of DLC.
这些结论对设计与改进DLC的制备工艺具有重要的指导意义。
Also, the functions of halogen atoms in CVD diamond deposition process are discussed in detail in this paper.
还详细讨论了卤素原子在金刚石薄膜淀积过程中的作用。
Ti-O film was prepared by microwave-electron convolute resonance (MW-ECR) magnetron filter arc deposition process.
采用微波电子回旋共振磁过滤弧设备制备钛氧薄膜。
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