The relations between process and product characteristic of straw packaging material and the influence of density of straw packaging material on its performance were studied.
研究了麦秸防护内衬包装材料的工艺和产品特性之间的关系，以及密度对这种材料性能的影响。
With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
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