The influence of anode current density, polishing temperature, polishing time and stirring modes on polishing quality was discussed.

探讨了阳极电流密度、抛光温度、抛光时间和搅拌方式对抛光质量的影响。

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Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.

作为VLS I互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。

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In this paper the method of density matrix is used to describe two coupled modes.

采用密度矩阵方法描述了两模反向耦合。

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