The influence of anode current density, polishing temperature, polishing time and stirring modes on polishing quality was discussed.
探讨了阳极电流密度、抛光温度、抛光时间和搅拌方式对抛光质量的影响。
Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.
作为VLS I互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。
In this paper the method of density matrix is used to describe two coupled modes.
采用密度矩阵方法描述了两模反向耦合。
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