不以固定的封装体引线间距尺寸为基础而以规定封装体大小为基础制成的四边带了形或I型短引线的高度气密封装的陶瓷芯片载体
... 14有引线陶瓷芯片载体leaded ceramic chip carrier(LDCC) 15 C型四边封装器件C-hip quad pack;C-hip carrier 16带状封装tapepak packages ...
基于1个网页-相关网页
... 14有引线陶瓷芯片载体leaded ceramic chip carrier(LDCC) 15 C型四边封装器件C-hip quad pack;C-hip carrier 16带状封装tapepak packages ...
基于1个网页-相关网页
... 14有引线陶瓷芯片载体leaded ceramic chip carrier(LDCC) 15 C型四边封装器件C-hip quad pack;C-hip carrier 16带状封装tapepak packages ...
基于1个网页-相关网页
... 14有引线陶瓷芯片载体leaded ceramic chip carrier(LDCC) 15 C型四边封装器件C-hip quad pack;C-hip carrier 16带状封装tapepak packages ...
基于1个网页-相关网页
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