The case of burrs defective in cyanide tin - copper alloy deposits were investigated and preventive methods were proposed.
分析了氰化镀铜锡合金过程中镀层出现毛刺弊病的原因，并提出了解决方法。
The paper provides several substrate plating technologies of zinc alloy cast piecework to substitute cyanide copper plating.
本文介绍了几种取代氰化镀铜的锌合金电镀打底工艺。
The potential-time curves under constant current and cyclic voltammetry curves were measured, and the potential activation process of copper plating on iron substrate in cyanide electrolyte was shown.
进行了恒电流电位-时间曲线和循环伏安曲线的测定，显示了铁电极进行氰化物镀铜时，镀层沉积前铁表面的电位活化过程。
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