This paper firstly introduces semiconductor process flow, then introduces the definition and impact of the pad crystal defect, which is from wafer manufacturing process and will impact the reliability of package.
本文首先简单介绍了半导体芯片的加工流程,然后给出了压焊点晶体缺陷的概念和影响。 压焊点晶体缺陷来源于晶片的加工阶段,影响到后续封装的引线可靠性。
参考来源 - 压焊点晶体缺陷问题的程式优化研究·2,447,543篇论文数据,部分数据来源于NoteExpress
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