Dynamic buckling of the nano crystal copper wire under different load is simulated.
模拟了不同载荷下纳米铜线的动力屈曲型态。
This study focuses on the dynamic buckling of a nano crystal copper wire under compression stress wave.
用分子动力学方法和弹性动力学方法研究了纳米铜线的动力屈曲，并对两种方法进行了比较。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
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