There are chips out there todaythat are faster than the one in the iPhone and integrate graphics, cpu, and i/o (wifi/3g/wimax) on one die.
有的芯片比在iPhone里的那颗更快,并且整合了图形显示、cpu以及i/o(wifi/3g/wimax)通道。
More important than the CPU cores, however, is the fact that half the chip die is now taken up by the graphics-processing circuitry.
然而,比CPU核心,更重要的是一半的芯片模具现在采取的图形处理电路。
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