Both are on a separate die that is still manufactured in 45nm whereas the CPU die is already manufactured in the new 32nm process.
两者都是在一个单独的芯片是45纳米制造的,而仍然在CPU已经死了,是在新的32纳米工艺生产。
There are chips out there todaythat are faster than the one in the iPhone and integrate graphics, cpu, and i/o (wifi/3g/wimax) on one die.
有的芯片比在iPhone里的那颗更快,并且整合了图形显示、cpu以及i/o(wifi/3g/wimax)通道。
More important than the CPU cores, however, is the fact that half the chip die is now taken up by the graphics-processing circuitry.
然而,比CPU核心,更重要的是一半的芯片模具现在采取的图形处理电路。
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