fatigued copper single crystal 疲劳cu单晶
copper single crystal wire 铜单晶线材
copper single crystal surface 铜单晶表面
industrial copper single crystal 工业铜单晶
single crystal copper 单晶铜 ; 铜单晶
single crystal copper wire 单晶铜丝
single-crystal copper wire 单晶铜线材
In this paper, three typical lead-free solders were bonded to copper single crystal by reflow welding. The evolution of microstructure and the morphology at the three interfaces of lead-free solder/copper single crystal joints were investigated by isothermal aging experiment.
本实验选取典型的无铅焊料与铜单晶体进行热熔焊，通过对部分无铅焊料／Cu单晶体样品进行固定温度下的时效，分析了无铅焊料／Cu单晶体界面微观组织和形貌的演化。
参考来源 - 铜单晶体/无铅焊料的界面组织与性能·2,447,543篇论文数据，部分数据来源于NoteExpress
The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystal orientation of material.
铜单晶线材中位错蚀坑密度与材料浸蚀时间，变形量以及晶体学取向有关。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
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