It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
It is suitable for transition connection of the electric appliance of indoors distributing device and kinds of wire cables. It adopts T2 red copper, the surface adopt nickle plating.
适用于户内配电装置中电气设备和各种电线电缆的过渡连接，采用T2紫铜板制造，表面镀镍。
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