A new copper electroplating bath is found. MN(M、N、SPS、PE) and its substituent technics are researched by the Hull Cell Test.
本课题的目的在于研究无染料酸性镀铜的工艺新配方。
参考来源 - 无染料酸性镀铜工艺的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The matellization process of blind via or though hole is also achieved by means of copper electroplating.
盲孔或通孔的属化制程也是直接用电镀的方式完成。
The process of cyanide copper electroplating is replaced by the proposed process of pyrophosphate electroplating copper on magnesium alloy.
用研究的焦磷酸盐镀铜工艺代替氰化镀铜工艺作为过渡铜镀层的无氰镀工艺。
Copper electroforming and nickel electroforming processes were compared with copper electroplating and nickel electroforming process respectively.
对电铸铜与电镀铜工艺、电铸镍与电镀镍工艺进行了比较。
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