Cooling rate and time 冷却速度和时间
The RTP temperature, the RTP time, the cooling rate, the ambient and the dopant atoms influenced the density and distribution of point defects in wafers, and then affected oxygen precipitates.
快速热处理温度、时间、降温速度、退火气氛、掺杂原子等都对硅片中点缺陷的形成及分布产生影响，进而影响氧沉淀的形成。
In this article, a thorough investigation has been conducted into heating rate, holding time and cooling speed in an effort to work out an optimum ingot annealing process.
本文对铸件退火时如何控制加热速度、保温时间、冷却速度进行了充分的研究和探讨，为合理制定铸件退火工艺指出了方向。
The influences of cooling rate after the forge on the heating temperature and time of apheroidized annealing of steel T10 was studied.
研究了锻造后的冷却速度对T10钢等用球化退火加热温度和保温时间的影响。
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