The results show that valve-sieve compound trays have smaller turndown ratio and smaller capacity.
试验结果表明:浮阀筛孔复合塔板操作弹性小、气液处理量小;
Double hole diameters compound trays have a little larger capacity in comparison of single hole diameter compound trays and their turndown ratio is over 3.5.
双孔径复合塔板比单孔径复合塔板处理量略微增大,操作弹性高达3.5以上。
All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
所有的计算结果证明化合物厚度比为1.2,会使大芯片TSOP的翘曲问题最小化。
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