The thicknesses of the composite solder interface were compared with the Sn-3.5Ag eutectic solder.
本研究还将复合钎料与Sn-3.5Ag共晶钎料进行界面层厚度的对比。
参考来源 - 热输入对锡银基复合钎料基体中金属间化合物形态的影响·2,447,543篇论文数据，部分数据来源于NoteExpress
The invention relates to a copper particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种铜颗粒增强型锡银锌复合焊料及其制备方法。
Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.
史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。
The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。
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