Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.

焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。

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The mould component can be used for testing exothermic solder molten metal mobility.

该模具组件可以用以测试放热焊接剂熔化金属流动性。

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In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.

采用这种技术时，电路板的元件侧专用于接地层，信号走线则布设在焊接侧。

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