In contrast with metal and thermoplastic material, which has a higher coefficient of thermal expansion (CTE).
相较于金属和热塑材料，什么材料具有更高的热膨胀系数(CTE) ？
The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed.
介绍了微波多层板所用基材的性能参数，重点阐述了材料的介电常数、介质损耗、热胀系数、特性阻抗对多层板性能的影响。
For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
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