Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Bond materials: according to the ratio cement 97kg, scale graphite 3kg, clean water 35kg to paste form as backup.
黏结材料:以水泥97 KG、鳞片石墨3 KG、清水35 KG左右比例调成膏状备用。
For any adhesive to make a really strong bond, the surfaces to be glued must be absolutely clean and free from moisture or grease.
对任何黏合剂来说,要想真正粘得结实,胶合面必须要干净,没有一点水或油脂。
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