Copper Clad Laminates 覆铜箔层压板 ; 基材又称覆铜板 ; 覆铜板材料
ceramics base copper-clad laminates 陶瓷基覆铜箔板
uv blocking copper-clad laminates 紫外线阻挡型覆铜箔板
polyimide copper clad laminates 聚酰亚胺覆铜板
high frequency copper clad laminates 高频覆铜板
large dimension copper-clad laminates 大面积敷铜箔板
The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.
论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。
youdao
应用推荐
模块上移
模块下移
不移动