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Silicon devices are compatible with integrated-circuit technology.
硅元件和集成电路技术是相容的。
Intergrated circuit technology plays an important role in manufacturing sensors in the future.
集成技术在未来传感器制作中起重要作用。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装,完成了传感器的一体化,实现了传感器的小型化。
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