The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
散热片与集成电路封装热接触用于在工作过程中提取热量。
The invention involves the integrated circuit package domain, to be specific, involves when galvanizes to the base pin, prevents the permutation reaction the method.
本发明涉集成电路封装领域,具体地说,涉及对管脚电镀时,防止置换反应的方法。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
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