... 倒装芯片贴装 flip chip attach 倒装芯片基片 chip Substrates ; Flipchip Substrates 倒装芯片安装 flipchip bonding ; chip bonding ...
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The surface micromachining process uses either crystal silicon chip substrates as a foundation upon which to build layers, or can be started on cheaper glass or plastic substrates.
表面微加工工艺采用两种晶体硅芯片基板作为赖以建立层的基础,或者可以在更便宜的玻璃或塑料基板启动。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装(CSP)进行了研究,描述了CSP的工艺流程;
On the other hand, off-chip inductors on low loss substrates deliver much higher Q values.
另一方面,低功耗基板上的片外电感器能够提供较高的Q值。
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