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chip scale package
[tʃɪp skeɪl ˈpækɪdʒ]

  • 芯片尺寸封装:一种微型电子封装技术,将集成电路芯片封装在与芯片尺寸相近的外壳中,以减小封装尺寸、提高性能并降低成本。

专业释义

  • 芯片尺度封装
  • 晶片尺度封装

·2,447,543篇论文数据,部分数据来源于NoteExpress

权威例句

  • The upcoming vote pits the newly reconstituted board and turnaround management team at Tessera, a technology development and licensing firm that invented chip-scale packaging (CSP) technology for improved semiconductor performance in the 1990s and is now blazing a trail in advanced semiconductor interconnect technology, against a board takeover attempt by the activist hedge fund Starboard Value LP.

    FORBES: Don't Turn My Company Into A Patent Troll!

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