... chip layout ==> 芯片布置布线图 chip level ==> 片级 chip level complexity ==> 芯片级致密度 ...
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不过,IC设计人员面临的新挑战出现在芯片级(chip level),包括多供电电压支持、多个软模块的分层整合、分层信号与设计完整性,还有时间延迟预估问题。
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小片级
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chip level complexity 芯片级致密度
chip-level integration 芯片级集成
Chip Level Specification 从事芯片级设计规范
Chip Level Packaging 层次的封装 ; [电子] 片级组装
chip-level 芯片级
CHIP-LEVEL CDM 芯片层级组件充电模式 ; 层级组件充电模式
Chip-Level Charged Device Model 芯片层级组件充电模式 ; 层级组件充电模式
chip-level hardware encapsulation 芯片级硬件封装
·2,447,543篇论文数据,部分数据来源于NoteExpress
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