Chip interconnection is an important part in the microelectronics parts manufacture process.
内引线连接是微电子器件制造过程中的重要环节之一。
Higher performance of the on-chip interconnection is needed because of the improvement of the system-on-chip integration and application requirements.
应用需求的增长和系统芯片集成度的不断提高，对系统芯片片上互连结构提出了更高的要求。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
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