ceramic chip land-grid array 陶瓷芯片焊盘栅阵列
Flip Chip Pin Grid Array 反转芯片针脚栅格阵列 ; 倒装芯片插针栅数组
flip chip-plastic grid array 倒装芯片塑料栅列
Flip-Chip Ball Grid Array 翻转芯片球引出端阵列 ; 球栅阵列倒装
Flip- Chip Ball Grid Array 翻转芯片球引出端阵列
chip ball grid array 芯片球栅阵列
FC-BGA Flip-Chip Ball Grid Array 反转芯片球形栅格阵列
ball grid array chip 球栅阵列芯片
FC LGAFlip-Chip Land Grid Array 反转芯片栅格阵列
Automatic gene chip image grid localization is an essential task for gene chip image analysis.
对基因芯片荧光图像进行网格定位是进行芯片分析的前提与关键。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
With the appearance of high-performance Digital Signal Processor (DSP) chip, it is possible that some most advanced control strategies can be used to the PV grid-connected system.
高性能的数字信号处理器芯片(dsp)的出现，使得一些先进的控制策略应用于光伏并网的控制成为可能。
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