The higher calories which the higher power consumption bring out make the chip encapsulation and coolant device's cost increase more, even there are technique restrictions.
高功耗带来的高热量使得芯片的封装和散热装置造价巨增，并存在技术上的限制。
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
The paper puts forward a kin of numerical controlled laser cutting technique applied to wipe off encapsulation of chip.
本文研究了一种用于去除封装材料的数控精密激光切割技术。
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