This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
A bonding pad with an RFID chip disposed thereon is arranged at the central area of the pair of extended conductive arms.
一置晶座和一射频识别(RFID)晶片设置在其上，位于该对导线臂的中心。
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