flip chip bonder 倒装焊接机 ; 倒装片接合机 ; 设备 ; 覆晶固晶机
flip-chip bonder [电子] 倒装焊接器
fully automatic chip bonder 全自动芯片键合机
flip-chip p bonder 倒装式焊接器
flip chip alignment bonder 倒焊机
flip-chip ultrasonic bonder 倒扣片超声压焊机
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
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