CP Chemical Polish 化学抛光剂
chemical polish etching 化学抛光刻蚀
Polish Chemical Society 波兰化学会
Chemical Mechanical Polish 化学机械研磨 ; 化学机械抛光
chemical-mechanical polish 化学坏抛光法一种去掉圆片表面某种物质的方法
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
In the wedding before two weeks of stopping the use of nail polish and avoid exposure to chemical detergent, let your nails with a finishing period.
在婚礼的前两周停止使用指甲油并尽量避免接触化学洗涤剂，让你的指甲有一个修整期。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
应用推荐