最后通过化学机械抛光（chemical Mechanical Polish，CMP）将上层多余的铜和扩散阻挡层去掉，沟槽宽度和深度一般在几十 北京工业大学工学硕士学位论文 纳米到几个微...
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chemical-mechanical polish 化学坏抛光法一种去掉圆片表面某种物质的方法
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
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