The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanical lapping, has an important influence on the polishing rate.

分析了W - CMP的机理，抛光液对W材料表面具有化学腐蚀和机械研磨的双重作用，对抛光速率有着重要的影响。

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An electro-chemical ultra-precision lapping machine with five freedoms of X-, Y- and Z-axis linear movement as well as rotation about X- and Z-axis is developed.

研制了能够实现X、Y、Z三轴直线运动和绕X、Z两轴转动的空间五自由度电化学超精密研磨机床。

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