The research objects include power module, power plane, ground plane, bypass capacitor, encapsulation of high-speed chip and inside power distribution.
研究对象包含了组成电源分配系统的电源模块，电源平面、接地平面、旁路电容和高速芯片的封装及内部电源分配等问题；
The "bypass" switch module seems to be prone to failure and intermittency as well.
“搭桥”开关模块，似乎很容易失败及间歇等。
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