This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.

本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。

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Bridgehead bump is one of the urgent problems in the process of highway construction.

桥头跳车是目前公路建设中急需解决的问题之一。

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The pipes are infinite and you're going to bump your head, and it's a part of the process.

管道无穷无尽，你可能会磕到头，这是这个过程的的一部分。

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That process, which was developed by the California-based startup Bump Technologies, worked by knocking two devices together.

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For instance, clouds rising in the troposphere, the lower level of the atmosphere where air mixes freely, will bump up against the boundary of the much more stable stratosphere, forming ripples in the process.

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