klebedruck bonding pressure 粘接压力
gas pressure bonding 高温气的等压法 ; 气体压力键结 ; 气体孔隙率
solid-liquid pressure bonding 固液相压力复合
Pulse Pressure Diffusion Bonding 脉冲加压扩散连接
pressure bonding 加压焊接
gas-pressure bonding 气体加压粘接
excessive-pressure bonding 水下超压干式焊
Semi-solid Pressure Bonding 半固态压力复合
The optimal parameters of diffusion bonding are:the vacuum is higher than 10-2Pa, the bonding temperature is 920℃, the bonding pressure is 3.0 MPa and the bonding time is 90min.3.
2.在本试验条件下,DB的合适工艺参数为:真空度高于10-2Pa,温度920℃,加载压力3.0MPa,保温时间为90min。
参考来源 - 钛合金超塑成形/扩散连接组合工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Bonding pressure imposition can be used as one of the methods modifying braze metal.
加压可以作为一种改性钎缝金属的方式。
The article analyzed the relations between the bonding pressure and the bonding strength through the experiment.
通过实验，研究了键合强度与键合压力间的关系。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
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