It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
The bonding strength calculating formulas are presented. Which were referred to the tensile characteristic of concrete, and shows good agreement with the test results.
给出了与混凝土本身抗拉性能相关的、与试验结果符合良好的粘结强度计算公式。
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