Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
In this paper, an automatic wire bonder is presented.
本文介绍了一台自动引线键合装置。
At present, the algorithm has been applied to the image matching system of the fully automatic gold wire bonder.
目前，该算法已在全自动金丝球焊机的图像识别系统中得到实际应用。
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