By controling the three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
The diameter, length, arch height and space of bond-wires have great impacts on the radio frequency performance of RF power transistor.
键合线的直径、长度、拱高和并列键合线间距等物理参量，均对器件性能有很大影响。
By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used.
工作原理是通过X-Y工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。
应用推荐