Bond paper application, traditional hand-package soup new problems brought about by the process, this article from entrapment adhesives, technological conditions [hot back temperature (T), time (t) as a preliminary study.
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bond paper application
铜版纸应用
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The application of feature analysis of ultrasonic nondestructive testing(UNDT)of adhesive bond structures(ABS)is presented in this paper.
本文介绍了超声无损检测特征参数分析在胶接结构中的应用。
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